The Exynos W920 comes with a Fan-Out Panel Level Packaging (FO-PLP) design that allows the company to squeeze the size of the chipset to the smallest possible.
from Top Tech News- News18.com https://ift.tt/3jNn2ca
Samsung Exynos W920 Launched As First 5nm Wearable SoC; Supports New Samsung-Google UI
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